Product description
It is a two-component low-density potting adhesive with room temperature or heating curing, and the higher the temperature, the faster the curing characteristics. It can be used on PC (Po-ly-carbonate), PP, ABS, PVC and other materials and metal surfaces, and can be used under -40℃~200℃. It can be used at -40℃~200℃. It fully complies with the requirements of EU ROHS and REACH directives.
Product Use
Silicone low density potting adhesive can be used for filling shock absorption, cushioning, insulation and heat insulation protection of power battery module cells. Other electronic components potting protection.
Product parameters
Notes:
1 B above performance data before curing are measured at 25 ℃, relative humidity 55% after 7 days of curing. The product surface drying time will slow down accordingly as the storage time becomes longer.
2 B mechanical and electrical properties data are measured after the specimen is completely cured.
3B Our company is not responsible for data differences caused by different testing conditions or product improvements.
Processes used
1、Before mixing: Firstly, mix component A and component B in their respective containers thoroughly.
2、Mixing: A component: B component = 1:1 weight ratio should be observed, and stirred evenly.
3、Drain bubble: After mixing, the rubber should be vacuum-drained for 1-3 minutes.
4、Potting: The mixed adhesive should be potted into the product to be potted as soon as possible, so as not to thicken the adhesive and have bad liquidity later.
5、Curing: heating curing, the higher the temperature, the faster the curing speed.
Cautions
1、The rubber should be stored in a dry room temperature environment and sealed, the mixed rubber should be used up as soon as possible to avoid waste.
2、This product is non-dangerous, but do not enter the mouth and eyes.
3、The product is non-toxic, with good physiological inertia, no irritation and harm to the skin. The product does not contain flammable and explosive ingredients, will not cause fire and explosion accidents, no special requirements for transportation.
4、After a period of storage, the adhesive will precipitate and stratify. It should be used after stirring evenly, it will not affect the performance.
5、The following substances may hinder the curing of the product, or the phenomenon of non-curing, so it is better to apply after simple experimental verification, and if necessary, it is necessary to clean the application site.
a Incompletely cured condensed silicone adhesive. b Amine curing epoxy resin. c White wax welding place or rosin welding joints.
Packaging specifications and storage and transportation
1、A agent 5kg/drum, 10kg/drum; B agent 5kg/drum, 10kg/drum.
2、The storage period of this product is 180 days (below 25℃). Products beyond the storage period should be used only after confirming that there is no abnormality.
3、These products are non-dangerous products and can be transported as general chemicals.
Recommendations and Statements
Users are recommended to do suitability test before using this product officially. Due to the diversity of practical applications, our company does not guarantee the problems arising from the use of our products under specific conditions and does not assume any responsibility for direct, indirect or accidental losses. Users can contact our after-sales service department if they encounter any problems during use, and we will do our best to provide you with assistance.